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HX-2022 UV moisture coating material
The main component of HX-2022 is polyurethane modified acrylic acid, which is a solvent-free UV moisture dual curing three proof adhesive; It is widely used on the surfaces of printed circuit boards, electronic components, integrated circuits, etc., forming a dense protective film to protect various electronic components and solder joints; Can be cured by UV and moisture dual curing, and for shaded areas that cannot be cured by light, it can be cured within 3-5 days; It is a high-end product with excellent performance such as chemical resistance, high temperature resistance, high adhesion, and high hardness.
List of Main Performance Parameters
| state |
project |
Parameter performance |
| Before curing |
Specific gravity, 25 ℃ g/cm3 |
1.03 |
| Viscosity, 25 ℃ CPS |
150 /-50 |
|
| Curing speed (surface dry/full solid) |
2-5s/25s (thickness 30-60um, 1000W 365nm) |
|
| Curing and shaping |
Thermal expansion coefficient (TMA) ppm/℃ |
87 (less than Tg) |
| Modulus (DMA), 25 ℃, MPa |
230 |
|
| Hardness (Shore D) |
65 |
|
| Volume resistivity Ω. m |
1.6*1015 |
|
| Dielectric constant (1MHz) |
3.2 |
|
| Dielectric strength (KV/mm) |
60 |
|
| Surface resistance Ω |
2*1015 |
|
| Shear strength MPa |
>10 |
|
| Tg (DSC) |
45.5℃ |
|
| High temperature resistance performance |
Capable of withstanding high temperatures of 200 ℃ with unchanged performance |
|
| Solvent resistance |
excellent |
Yue Gong Wang An Bei No. 4419002005671